Polishing相关论文
The effects of 3 chairside polishing kits and mechanical brushing on the surface roughness of 3 different acrylic dentur......
In the rapid spray metal tooling,the metal film is spray-formed on the substrate and supported under the back,which fina......
In ELID (Electrolytic In process Dressing) grinding, the oxide film on grinding wheel plays an important role inimprovin......
Large diameter aspherical reflector polishing technology is a kind of technology which has big difficulty,long process c......
Precision is one of the most important aspects of manufacturing. High precision creates high quality, high performance, ......
通过在石英玻璃的抛光过程中引入α-Al2O3颗粒,对抛光过程中石英工件表面产生的划痕类型和收尾阶段不同粒径杂质颗粒产生的划痕长......
采用热弹性模型, 对光学薄片点胶过程进行了有限元分析。对点胶后影响工件面形变化(Δp)的工艺参数进行了优化。研究结果表明, 对......
全口径环形抛光中方形元件的材料去除率存在从中心到边角位置越来越大的现象,致使抛光工件出现塌角的面形,影响了方形光学元件的面......
为了研究不同杂质颗粒物对划痕的影响及其大小与划痕形貌之间的关系，在钕玻璃抛光过程中分别引入三种尺寸的金刚砂、氧化铈团聚物和......
The transverse electro-optic(EO)modulation system is built based on cubic boron nitride(cBN)single crystals unintentiona......
Three kinds of aggregates were polished by genuine pneumatic rubber tyres.The initial states of surface texture and dyna......
Novel precipitant prepared through carbonation with MgCl2 wastewater generated from rare earth extraction separation pro......
Micro water dissolution machining principle and its application in ultra-precision processing of KDP
In this paper, a micro water dissolution machining(MWDM) principle is proposed for machining potassium dihydrogen phosph......
与现有的金刚石膜抛光工艺相匹配的高效刻蚀技术，是目前研究的热点。自行研制的稀土 化合物浆料对 CVD金刚石厚膜进行了刻蚀研究，刻......
提出了一个机械化学抛光中晶圆材料非均匀性的有限元模型.通过分析压力、摩擦力、抛光垫和承载膜的可压缩性对晶圆的应力分布的影......
A modified electrolyte (CH_3COOH-HClO_4-A-B) for electropolishing (EP) of NiTi was presented for improving the corrosion......
从亚微米进入到1/4μm 时代,VLSI 工艺中的平坦化技术与其它的微细加工技术一起被广泛采用。然而,该技术已作为一种独特的关键技......
Nitinol,a shape memory alloy(SMA),is manufactured from titanium and nickel.It is employed in various fields for use in d......
提出采用金刚石膜/硅复合材料作为MSGC基板的可行性。采用热丝辅助化学气相沉积(HFCVD)技术和相关退火工艺获得了金刚石膜/硅复合......
重点讨论了化合物半导体材料加工中的先进光刻技术应用现状。薄形衬底材料在高频及功率器件中的需求,在处理非常易碎和昂贵的衬底......
Three main machining processes of large-diameter 6H-SiC wafers were introduced in this paper. These processes include cu......
The conception of the soft layer during chemical mechanical polishing(CMP) was proposed for the first time. The soft lay......
Effect of Overlaid Material on Optical Transmission of Side-Polished Fiber Made by Wheel Side Polish
The performance of optical power transmission through a side-polished fiber on which materials of different refractive i......
A New method,named atmospheric pressure plasma polishing,for the ultra-smooth machining of the silicon based materials i......
Copper chemical mechanical polishing (CMP) is influenced by geometric characteristics such as line width and pattern den......
Modeling and experimental research on a removal mechanism during chemical mechanical polishing at th
In order to understand the fundamentals of the chemical mechanical polishing(CMP) material removal mechanism,the indenta......
With the use of a chemical-mechanical polishing(CMP) simulator verified by testing data from a foundry, the effect of du......
The effect of the ammonium molybdate concentration on the material removal rate(MRR) and surface quality in the prelimin......
Effects of the reciprocating parameters of the carrier on material removal rate and non-uniformity i
Based on the Preston equation,the mathematical model of the material removal rate(MRR),aiming at a line-orbit chemical m......
A signal processing method for the friction-based endpoint detection system of a chemical mechanical polishing(CMP) proc......
针对AlN基片CMP平坦性问题,从pH值、磨料粒度以及磨料的质量分数等方面研究了抛光液参数对抛光效果的影响。通过对AlN基片进行抛光......
Origin of high oxide to nitride polishing selectivity of ceria-based slurry in the presence of picol
We report on the investigation of the origin of high oxide to nitride polishing selectivity of ceria-based slurry in the......
The influence of GaAs substrate on the transmission performance of a multi-film Fabry-P’erot filter (FPF),fabricated by......
Chemical mechanical polishing (CMP) was used to etch various GaN materials, such as GaN layers on sapphire and silicon c......
A new process of magnetorheological figuring(MRF) based on the deliquescence theory is proposed to finish KDP crystals.A......
The composition of the polishing solution is optimized by investigating the impact of the WIWNU (the so-called within-wa......
Chemical mechanical polishing(CMP) is the most effective wafer global planarization technology.The CMP polishing head is......
A ball grid array (BGA) package based on Si interposer with through silicon via (TSV) was designed. Thermal behaviors of......
A model for calculating friction torque during the chemical mechanical polishing(CMP) process is presented,and the frict......
Gaseous-process silica white is an important reinforcing filler and multifunctional additive.It is extensively used in ......
Thinning and polishing of cross-section of depth-graded WSi_2 /Si multilayer for linear zone plate a
A linear zone plate named multilayer laue lens (MLL) is fabricated using a depth-graded multilayer structure. The lens s......
Nd-doped phosphate glass is the dominant amplifier material used in solid state high average power laser systems.Surface......
In existing integrated circuit (IC) fabrication methods,the yield is typically limited by defects generated in the manuf......
We prepared germanium-on-insulator(GOI) substrates by using Smart-CutTM and wafer bonding technology. The fabricated GOI......
Corrosion electrochemical mechanism of chemical mechanical polishing of copper in K_3Fe(CN)_6 soluti
Polarization curves of copper were measured in NH 3·H 2O media containing K 3Fe(CN) 6. Components of passive film w......
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